Title:
HIGH-FREQUENCY SUBSTRATE
Document Type and Number:
Japanese Patent JP2018160636
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-frequency substrate which is inexpensive and excellent in heat dissipation, which can enhance heat dissipation of the high-frequency substrate mounted with high density and can protect an electronic device from heat generation over a long period of time.SOLUTION: A high-frequency substrate according to the present invention includes a substrate for high frequency signal high speed transmission that includes a glass epoxy substrate (FR-4) for supplying large power formed on one side of an adhesive layer made of an epoxy resin containing at least one kind of ceramic particles selected from a group consisting of aluminum nitride, aluminum oxide, and silicon carbide, and in which a copper layer is disposed on at least one side of a substrate selected from a group consisting of a fluororesin having a low dielectric constant of 5 or less (1GHz), a cycloolefin polymer (COP), and a liquid crystal polymer on the other surface.SELECTED DRAWING: None
Inventors:
KITAGAWA NAOAKI
Application Number:
JP2017058316A
Publication Date:
October 11, 2018
Filing Date:
March 24, 2017
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H05K3/46; B32B15/08; C09J7/20; C09J11/04; C09J163/00; H05K1/03