PURPOSE: To drastically improve the shape accuracy of the flatness, thickness, etc., of the wafer to be cut out, by detecting at all times the position in the axial direction of the blade of an inner peripheral edge type to be cut in the body to be cut and correcting continuously the displacement in the axial direction of the blade face by the positional signal thereof.
CONSTITUTION: Detecting heads 11a, 11b detecting the position of a blade 4 in the axial direction at all times are provided at the vicinity place of the part of the blade 4 of an inner peripheral blade type passing through the body to be cut(ingot) by its cutting. The displacement in the axial direction of the blade face is continuously corrected by solenoid heads 12a-12d based on the signal transmitted from the detecting heads 11a, 11b. Consequently a wafer can be cut out by this blade 4 with good accuracy from the body to be cut.
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HARA SOTOMITSU
MOTOE SHINJI
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