To provide a polishing pad for an increase in wafer yield by increasing removal rate to increase throughput.

The polishing pad includes a center, an inner region surrounding the center, and a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with high-rate paths. The transition region is adjacent to the outer region and within a radius from the center defined as follows, and the inner region is to be the origin of continuous grooves extended without a break to the outer region.

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