Title:
高速解体装置
Document Type and Number:
Japanese Patent JP7307945
Kind Code:
B2
Abstract:
To realize high-speed separation of an electronic board, a battery, a casing and the like without imparting excessive breakage or excessive impact to an electronic apparatus to be crushed.SOLUTION: A high speed dismantling device includes a storage mechanism 1 having a discharge port 1a for storing a loaded electronic apparatus and discharging it to a conveyor 2, a positioning mechanism 4 for positioning the electronic apparatus on the conveyor 2 so as to be in a prescribed attitude, and a cutting mechanism 5 for cutting the electronic apparatus in a prescribed width along both longer sides of the electronic apparatus carried in a positioned state. By an impacting device 7 impacting the inside of the electronic apparatus whose ends on the longer sides have been cut with the cutting mechanism 5, an electronic board, a battery and a casing in the loaded electronic apparatus are reliably separated.SELECTED DRAWING: Figure 2
Inventors:
Takao Ueda
Shigeki Furuya
Tatsuya Ohki
Shigeki Furuya
Tatsuya Ohki
Application Number:
JP2019145295A
Publication Date:
July 13, 2023
Filing Date:
August 07, 2019
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
B02C19/00; B02C13/04; B02C18/02; B02C18/22
Domestic Patent References:
| JP2017164707A | ||||
| JP2016101560A | ||||
| JP2013211234A | ||||
| JP2021023894A | ||||
| JP2006267801A | ||||
| JP7186443B2 | ||||
| JP2002071156A | ||||
| JP2017204514A | ||||
| JP2018161615A |
Foreign References:
| US20020162207 |