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Title:
HIGH-SPEED INTERFACE CIRCUIT INSPECTION MODULE, OBJECT MODULE FOR HIGH-SPEED INTERFACE CIRCUIT INSPECTION, AND HIGH-SPEED INTERFACE CIRCUIT INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2005337740
Kind Code:
A
Abstract:

To achieve both low costs and high inspection guarantee level in shipping inspection of an LSI equipped with a high-speed interface circuit.

The high-speed interface circuit inspection module comprises a high-speed interface circuit 112 which is mounted on a load board 103 which interfaces with an LSI tester 102, is provided with a circuit for converting a signal speed and can change in transmission/reception properties; a control part 113 which controls the transmission/reception properties of the high-speed interface circuit; a clock generator 111 which generates clocks to be supplied to the high-speed interface circuit; a first connector 110 only for high-speed interface which is connected to the high-speed interface circuit and is provided with a signal port for establishing high-speed signal communications with a circuit to be inspected; and a second connector 109 which is connected to the high-speed interface circuit and LSI tester and is provided with a signal port and a power source port for establishing low-speed signal communications with the high-speed interface circuit.


Inventors:
KISHIMOTO SATOSHI
KANEMITSU TOMOHIKO
MAEKAWA MICHIO
Application Number:
JP2004153376A
Publication Date:
December 08, 2005
Filing Date:
May 24, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01R31/26; G01R31/28; G01R31/317; G01R31/319; G06F13/00; H04L12/26; G01R31/30; (IPC1-7): G01R31/28
Attorney, Agent or Firm:
Akio Miyai
Makoto Ito