HIGH-SPEED HEATING/COOLING WAFER TREATMENT ASSEMBLY AND METHOD OF MANUFACTURING IT

Title:

HIGH-SPEED HEATING/COOLING WAFER TREATMENT ASSEMBLY AND METHOD OF MANUFACTURING IT

Document Type and Number:

Japanese Patent JP2006196873

Kind Code:

A

Abstract:

To provide an improved-type wafer treatment assembly that provides a controlled, uniform heat cycle for treatment of at least one wafer, the heat cycle being high speed, stable, reproducible, and excellent in energy efficiency.

The heat control apparatus for wafer treatment has (a) a platform for placing heating objects in various size, (b) at least one shaft extending approximately perpendicular to the platform, and (c) a plurality of resistance heating elements patterned into a plurality of circuits defining at least one zone for independently performing controlled heating to the objects having different sizes on the platform.

Inventors:

MARINER JOHN
PRASAD SRIDHAR R
WINTENBERGER ERIC
LU ZHONG-HAO

Application Number:

JP2005343644A

Publication Date:

July 27, 2006

Filing Date:

November 29, 2005

Export Citation:

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Assignee:

GEN ELECTRIC

International Classes:

H01L21/324; H05B3/74

Attorney, Agent or Firm:

Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa

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