Title:
HIGH STRENGTH COPPER ALLOY EXCELLENT IN MIGRATION RESISTANCE
Document Type and Number:
Japanese Patent JPH03285035
Kind Code:
A
Abstract:
PURPOSE: To manufacture a high strength copper alloy excellent in migration resistance by preparing a copper alloy contg. specified ratios of Ti, Ni and Sn.
CONSTITUTION: A copper alloy contg., by weight, 0.1 to 1.0% Ti, 0.3 to 2.5% Ni, 1.0 to 3.0% Sn and the balance Cu with inevitable impurities is prepd. Furthermore, total about ≤0.5% of elements such as Fe, Cr, Co, Zr, Mg, Si or the like may be incorporated therein. In this way, the copper alloy excellent in migration resistance and having good strength and electrical conductivity can be obtd. and is suitable for electrical and electronic equipment parts such as connectors.
Inventors:
OYAMA YOSHIMASA
ASAI MASATO
EGUCHI TATSUHIKO
SHINOZAKI SHIGEO
ASAI MASATO
EGUCHI TATSUHIKO
SHINOZAKI SHIGEO
Application Number:
JP8671890A
Publication Date:
December 16, 1991
Filing Date:
March 31, 1990
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/02; H01B1/02; (IPC1-7): C22C9/02; H01B1/02