To provide a polyimide film improved in adhesiveness.

This polyimide film comprising (1) a polyimide obtained from 1,4-phenylenediamine, 4,4'-diaminodiphenyl ether, and pyromellitic dianhydride and (2) inorganic particles having particle size in a range of 0.01 to 1.5 m and having an average particle size of 0.05 to 0.7 m in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized in that the polyimide film has a surface free energy of 80 mN/m measured on the basis of a contact angle method by applying an electric discharge treatment to the film. The present invention further includes a method for producing the polyimide film.