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Patent Searching and Data


Title:
HIGHLY CONDUCTIVE AND HIGHLY BENDABLE COPPER ALLOY WIRE
Document Type and Number:
Japanese Patent JP2000133049
Kind Code:
A
Abstract:

To provide a highly conductive and highly bendable copper alloy wire and a manufacturing method thereof suitably used for a driving cable conductor of robot.

This copper alloy wire comprises a chromium fiberreinforced copper formed or a copper alloy matrix complex material formed in situ. In this case, a wire rod is constituted by forming a chromium layer fiber in copper or a copper alloy matrix in situ. The wire surface is subjected to copper-plating at an intermediate stage of a manufacture step of the wire and the copper plating layer is reformed by applying a plastic processing and then, a heat treatment is applied to the copper in a nonoxidation atmosphere to release a machining distortion. An amount of the chromium layer fiber component is preferably 8-25 wt.%.


Inventors:
TAKAHARA HIDEFUSA
KOBAYASHI SHIGERU
Application Number:
JP29942098A
Publication Date:
May 12, 2000
Filing Date:
October 21, 1998
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
YOSHINOKAWA ELECTRIC WIRE & CA
International Classes:
H01B5/02; C22C47/00; C22C49/02; H01B7/04; H01B13/00; (IPC1-7): H01B5/02; C22C49/02; H01B7/04; H01B13/00
Attorney, Agent or Firm:
Toshiro Mitsuishi (1 person outside)