To reduce connection resistance, to increase electric capacity in connection and to stabilize the connection by dispersing conductive fine particles on each surface of which a covering layer that is formed of a low melting point metal and has a specific thickness is formed and of which average particle diameter has a specific value into a film that does not substantially flow at least at the time of crimp.

This anisotropic conductive film is composed by dispersing, into a film that does not substantially flow at least at the time of crimp, conductive fine particles of which covering thickness is 1/20-1/4 of each of the diameters of the conductive fine particles, on each surface of which a covering layer formed of a low melting point metal is formed and of which average particle diameter is 0.2-1000, preferably 5-300 μm, and a current is carried through the conductive fine particles dispersed into the anisotropic conductive film. The conductive fine particles can accomplish direct metal bonding at a bonding part to an electrode because the low melting point metal layer is formed on each of their surfaces. Therefore, in a conductive connection structural body, high reliability and large electric capacity can be secured, leakage between adjacent electrodes can be prevented, and the concentration of the conductive fine particles can be increased.