Title:
HOLDING DEVICE OF SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPS6151916
Kind Code:
A
Abstract:
PURPOSE:To enable holding semiconductor substrate pressed on the surface of a base in a simple construction and in a narrow space by moving pawls provided on the base and hold the outer circumference of the semiconductor substrate in plural positions perpendicularly to the base. CONSTITUTION:On the press surface 5 of a base 4, plural pawls 6-9 which can move to the direction perpendicular to the press surface 5, part of these can move along the base 4, and hold the outer circumference of a semiconductor substrate A transferred along the base 4 toward the base 4 are provided. The above-mentioned partial pawls 8, 9 are moved along the base 4, the pawls 6-9 are moved to the direction perpendicular to the press surface 5 and the held surface of the semiconductor substrate A is pressed on the press surface 5 of the base 4. This construction is simple and a low price and holding of the semiconductor substrate is also easy and secure.
Inventors:
ISHIKAWA KAZUO
Application Number:
JP17470884A
Publication Date:
March 14, 1986
Filing Date:
August 22, 1984
Export Citation:
Assignee:
TOSHIBA MACHINE CO LTD
International Classes:
H01J37/317; H01J37/20; H01L21/265; (IPC1-7): H01J37/20; H01J37/317; H01L21/265
Attorney, Agent or Firm:
Takehiko Suzue