To prevent a phenomenon in which an inner lead 3 is displaced and lifted, by preventing continuous formability caused by the occurrence of the displacement of the inner lead in a package hollow part at the time of molding, and reducing and diffusing pull tension when removing the lower mold by the mold resin film on the surface without concentrating the pull tension on the joint of the mold resin and the inner lead in a hollow molded package of a CCD product.

The hollow molded package according to the present invention includes a lead frame 8 and a resin part 13 formed so as to sandwich the end of the lead frame 8 from the vertical direction.