Title:
HOLLOW SUBSTRATE INTEGRATED WAVEGUIDE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2022057529
Kind Code:
A
Abstract:
To provide a low-cost hollow substrate integrated waveguide circuit board that does not cause dielectric loss of an adhesive member.SOLUTION: A hollow substrate integrated waveguide circuit board C includes a first core member 1 in which a waveguide space 11 and a narrow wall surface 12 of a hollow substrate integrated waveguide are formed, and a second core member 2 and a third core member 3 that are bonded to the first core member 1 by an adhesive member 5 to form wide wall surfaces 21 and 31 of the hollow substrate integrated waveguide. The second core member 2 and the third core member 3 are formed with slot-shaped holes 22, 23, 32, and 33 extending in a direction parallel to the current direction of the wide wall surfaces 21 and 31. Plating is formed at a boundary position 51 between the waveguide space 11 and the adhesive member 5.SELECTED DRAWING: Figure 3
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Inventors:
ODA YASUAKI
Application Number:
JP2020165835A
Publication Date:
April 11, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
JRC MOBILITY INC
International Classes:
H01P3/12; H01P11/00; H05K1/02
Attorney, Agent or Firm:
Kenji Okada
Masaaki Hata
Mari Tanaka
Katsuhiro Imashita
Masaaki Hata
Mari Tanaka
Katsuhiro Imashita