Title:
ハニカム構造体
Document Type and Number:
Japanese Patent JP5103378
Kind Code:
B2
Abstract:
A honeycomb structure 1 comprising a honeycomb segment bonded body 10 having a number of honeycomb segments 2 integrated on each bonding planes via bonding material layers 9 has a structure so that a number of cells 5 providing fluid flow channels are disposed in parallel in the direction of center axis thereof. The honeycomb structure 1 is constructed so that the porosity of an outer portion of the bonding material layers 9 (an area from the interface with the honeycomb segment-bonding plane to a point apart from that interface by a distance equivalent to 20% of the entire layer thickness) is smaller than the porosity of a central portion located inward of the outer portion, and so that the bonding material layers 9 have a compression Young's modulus along the Z-axis of 5 to 100 MPa.
Inventors:
Koichi Iwata
Nao Masukawa
Atsushi Watanabe
Shuichi Ichikawa
Nao Masukawa
Atsushi Watanabe
Shuichi Ichikawa
Application Number:
JP2008507480A
Publication Date:
December 19, 2012
Filing Date:
March 23, 2007
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01D39/20; C04B37/00; F01N3/28
Foreign References:
| WO2005089901A1 | 2005-09-29 | |||
| WO2006098191A1 | 2006-09-21 |
Attorney, Agent or Firm:
Ippei Watanabe