Title:
半結晶質可撓性ポリオレフィンに基づくホットメルト接着剤
Document Type and Number:
Japanese Patent JP4540286
Kind Code:
B2
Abstract:
A flexible polyolefin-based hot melt adhesive composition having a variety of end uses, particularly in bonding polyethylene and polypropylene films, nonwoven fabrics and elastic attachment applications in nonwoven disposable articles. The composition includes a flexible polyolefin polymer or a blend of flexible polyolefin polymers, a tackifier resin, a plasticizer, and optionally a wax and a stabilizer. The preferred flexible polyolefin polymer has a melt flow rate greater than 5 g/10 min. and a density between 0.86 to 0.90 g/cm3. The hot melt adhesive composition provides a novel combination of desirable properties including good adhesion to a variety of substrates, low viscosity, good heat stability and oil resistance. The adhesive can be applied using common application techniques such as extruding or spraying.
Inventors:
One, Baoyu
Application Number:
JP2001553873A
Publication Date:
September 08, 2010
Filing Date:
January 19, 2001
Export Citation:
Assignee:
AT-O Findlay, Inc.
International Classes:
A61F13/49; A61F5/44; C09J123/02; A61F13/15; A61F13/472; C09J123/12; C09J123/14; C09J123/20; C09J157/02; C09J193/00; C08L57/02; C08L91/00
Domestic Patent References:
| JP2002514274A |
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Shurin Sakurai
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Shurin Sakurai