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Title:
HOT-MELT ADHESIVE COMPOSITION FOR FORMING FILM SUITABLE FOR WRAPPING HOT-MELT ADHESIVE PRODUCT, AND USE THEREOF
Document Type and Number:
Japanese Patent JP2013133472
Kind Code:
A
Abstract:

To provide a hot-melt adhesive composition for forming a film suitable for wrapping.

The hot-melt adhesive composition includes the following components (a)-(d), whose contents are expressed as weight percentages to the total weight of the composition: (a) 20-60 wt.% of at least one styrene block copolymer selected from the group consisting of a triblock copolymer of formula A-B-A, a diblock copolymer of formula A-B, and their mixture; (b) 5-55 wt.% of at least one tackifying resin having a number-average molecular weight between 200 Da and 10 kDa; (c) 10-40 wt.% of at least one wax having a melting point of 75-125°C and a number-average molecular weight of 500-1,500 Da; (d) 1-30 wt.% of at least one component selected from polyethylene wax and a polyolefin polymerized using a metallocene catalyst.


Inventors:
GOUBARD DAVID
Application Number:
JP2012000282152
Publication Date:
July 08, 2013
Filing Date:
December 26, 2012
Export Citation:
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Assignee:
BOSTIK SA
International Classes:
C09J153/02; C09J7/00; C09J7/02; C09J11/08; C09J123/06; C09J165/00; C09J191/00; C09J191/06
Attorney, Agent or Firm:
Takashi Koshiba
Hiroshi Koshiba