To provide a hot-melt adhesive composition for forming a film suitable for wrapping.

The hot-melt adhesive composition includes the following components (a)-(d), whose contents are expressed as weight percentages to the total weight of the composition: (a) 20-60 wt.% of at least one styrene block copolymer selected from the group consisting of a triblock copolymer of formula A-B-A, a diblock copolymer of formula A-B, and their mixture; (b) 5-55 wt.% of at least one tackifying resin having a number-average molecular weight between 200 Da and 10 kDa; (c) 10-40 wt.% of at least one wax having a melting point of 75-125°C and a number-average molecular weight of 500-1,500 Da; (d) 1-30 wt.% of at least one component selected from polyethylene wax and a polyolefin polymerized using a metallocene catalyst.