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Title:
WATER-SOLUBLE RESIN COMPOSITION FOR FINE PATTERN FORMATION AND METHOD FOR FORMING FINE PATTERN USING THE SAME
Document Type and Number:
Japanese Patent JP2013133471
Kind Code:
A
Abstract:

To provide a water-soluble resin composition with which a fine photoresist pattern can be formed by efficiently reducing a size of a contact hole pattern of a photoresist of a semiconductor process.

The water-soluble resin composition includes a water-soluble polymer with a predetermined structure and a first water-soluble solvent, and a size of a contact hole is reduced by applying the water-soluble resin composition to a photoresist film on which the contact hole pattern is formed and heat-treating the composition.


Inventors:
Park, Sang Wook
Jeon, Jong Jin
Application Number:
JP2012000095394
Publication Date:
July 08, 2013
Filing Date:
April 19, 2012
Export Citation:
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Assignee:
KOREA KUMHO PETROCHEMICAL CO LTD
International Classes:
C08F232/04; G03F7/11; G03F7/40; H01L21/027
Domestic Patent References:
JP2012155304A2012-08-16
JP2003066626A2003-03-05
JP2005077954A2005-03-24
JP2007256787A2007-10-04
JP2007121346A2007-05-17
JP2004037571A2004-02-05
JP2009104178A2009-05-14
JP2011524930A2011-09-08
Attorney, Agent or Firm:
中島 淳
加藤 和詳
西元 勝一