Title:
WATER-SOLUBLE RESIN COMPOSITION FOR FINE PATTERN FORMATION AND METHOD FOR FORMING FINE PATTERN USING THE SAME
Document Type and Number:
Japanese Patent JP2013133471
Kind Code:
A
Abstract:
To provide a water-soluble resin composition with which a fine photoresist pattern can be formed by efficiently reducing a size of a contact hole pattern of a photoresist of a semiconductor process.
The water-soluble resin composition includes a water-soluble polymer with a predetermined structure and a first water-soluble solvent, and a size of a contact hole is reduced by applying the water-soluble resin composition to a photoresist film on which the contact hole pattern is formed and heat-treating the composition.
Inventors:
PARK SANG WOOK
JEON JONG JIN
JEON JONG JIN
Application Number:
JP2012095394A
Publication Date:
July 08, 2013
Filing Date:
April 19, 2012
Export Citation:
Assignee:
KOREA KUMHO PETROCHEM CO LTD
International Classes:
C08F232/04; G03F7/11; G03F7/40; H01L21/027
Domestic Patent References:
| JP2012155304A | 2012-08-16 | |||
| JP2003066626A | 2003-03-05 | |||
| JP2005077954A | 2005-03-24 | |||
| JP2007256787A | 2007-10-04 | |||
| JP2007121346A | 2007-05-17 | |||
| JP2004037571A | 2004-02-05 | |||
| JP2009104178A | 2009-05-14 | |||
| JP2011524930A | 2011-09-08 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Kato Kazunori
Katsuichi Nishimoto