Title:
HOT MELT ADHESIVE AND HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH10130610
Kind Code:
A
Abstract:
To obtain a hot melt ethylene/vinyl acetate copolymer adhesive having excellent heat-resistant adhesiveness.
This invention provides a hot melt adhesive comprising an ethylene/vinyl acetate copolymer having a melt index(MI) of 10-5,000g/10min, a vinyl acetate content (VA) of 5-50wt.%, an Mw/Mn ratio of 2.0-4.0 and a low-molecular-weight component content of 24wt.% or below and satisfying the relationship: MP≥120-4.1[log(MI)]-1.33VA (wherein MP is the melting point expressed in °C, MI is expressed in g/10min, and VA is expressed in wt.%) and a hot melt adhesive composition comprising 100 pts.wt. above adhesive and up to 200 pts.wt. tackifier and/or up to 150 pts.wt. wax.
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Inventors:
WATANABE ICHIGEN
Application Number:
JP30355396A
Publication Date:
May 19, 1998
Filing Date:
October 30, 1996
Export Citation:
Assignee:
NIPPON UNICAR CO LTD
International Classes:
C09J123/08; C09J131/04; (IPC1-7): C09J131/04; C09J123/08
Attorney, Agent or Firm:
Nobuo Ono