To obtain a thermosetting polyester resin composition which is a high-molecular-weight product excellent in heat resistance, water resistance, etc., by short-time heating and is improved in blocking resistance without sacrificing performances such as heat resistance and water resistance.

This invention provides a thermosetting polyester resin adhesive comprising 100 pts.wt. thermosetting polyester resin composition being a high- molecular-weight product obtained by reacting 80-99.5wt.% polyester resin terminated mainly with hydroxyl groups and having a glass transition point of 30°C with 20-0.5wt.% aminoplast, 5-50 pts.wt. organic-solvent-soluble vinyl chloride/ vinyl acetate copolymer and 0.1-20 pts.wt. inorganic filler and an adhesive film obtained by coating a film with the above adhesive and drying it at 120°C or below.