Title:
HOT MELT ADHESIVE
Document Type and Number:
Japanese Patent JP2016074796
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hot melt adhesive that can be applied at a low temperature, has excellent blocking resistance, and has excellent properties, such as heating stability, adhesiveness, and heat creep resistance.SOLUTION: A hot melt adhesive according to the present invention contains 100 pts.mass of an ethylene-vinyl acetate copolymer having a melt flow rate of 500 g/10 min or more, 50-400 pts.mass of a C9 petroleum resin, and 50-100 pts.mass of wax. Consequently, the hot melt adhesive can be applied at a low temperature, has excellent blocking resistance, and has excellent properties, such as heating stability, adhesiveness, and heat creep resistance.SELECTED DRAWING: Figure 1
Inventors:
ISHII YASUYUKI
Application Number:
JP2014205217A
Publication Date:
May 12, 2016
Filing Date:
October 03, 2014
Export Citation:
Assignee:
SEKISUI FULLER CO LTD
International Classes:
C09J123/08; C09J5/06; C09J11/06; C09J123/06; C09J123/20; C09J131/04
Attorney, Agent or Firm:
Takuya Yamamoto