Title:
RESIN COMPOSITION AND RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2016074795
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a resin molded body having suppressed dimensional change under high temperature and high moisture environment.SOLUTION: There is provided a resin composition containing (A) a cellulose ester resin, (B) an epoxy group-containing plasticizer of 5 pts.mass to 10 pts.mass based on 100 pts.mass of the (A) cellulose ester resin and (C) a non-reactive plasticizer having no functional group reactive with the (A) cellulose ester resin of 10 pts.mass to 30 pts.mass based on 100 pts.mass of the (A) cellulose ester resin.SELECTED DRAWING: None
Inventors:
KAWASHIMA MANABU
MORIYAMA MASAHIRO
IKUNO MASAYA
YAO KENJI
MORIYAMA MASAHIRO
IKUNO MASAYA
YAO KENJI
Application Number:
JP2014205187A
Publication Date:
May 12, 2016
Filing Date:
October 03, 2014
Export Citation:
Assignee:
FUJI XEROX CO LTD
International Classes:
C08L1/10; C08K5/11; C08L63/00
Domestic Patent References:
| JP2013028771A | 2013-02-07 | |||
| JPS5643336A | 1981-04-22 | |||
| JPS60235852A | 1985-11-22 | |||
| JP2000007829A | 2000-01-11 | |||
| JPH11240942A | 1999-09-07 | |||
| JP2003082160A | 2003-03-19 | |||
| JP2013519754A | 2013-05-30 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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