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Title:
HOT RUNNER MOLD AND MANUFACTURE OF RESIN MOLDING BY UTILIZING HOT RUNNER MOLD
Document Type and Number:
Japanese Patent JPH10193401
Kind Code:
A
Abstract:

To attain smooth separation in the gate portion, and make pressure drop uniform in the resin conduit to each molding cavity by providing a plurality of branched portions in the runner portion so as to enable temperature to be controlled individually, and specifying the length of the gate.

At the stationary side 3 of a hot runner mold 1, heaters are installed inward for heat-retainable resin within a series of runner portions 8, and temperature sensors are also installed inward for controlling the temperature of the heaters. A heater 50 is disposed around the projection 47 of a manifold 32. Furthermore, heaters 51, 52, 53 are built in the main body of the manifold 32 in triple relation every two pieces so as to be in a regular hexagonal arrangement with respect to its coross-section. In addition, each independent heater is set in nozzle configured portions 33, 34 in order to make parallel branched portions 15, 16 temperature-controlled individually. Besides, the gate is made 1mm or less in its length.


Inventors:
SHIMURA SATOSHI
KAWACHI HITOSHI
Application Number:
JP551597A
Publication Date:
July 28, 1998
Filing Date:
January 16, 1997
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C45/26; B29C45/27; B29C45/73; B29C45/78; (IPC1-7): B29C45/26; B29C45/73; B29C45/78