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Title:
HOUSING FOR LAMINATED LAYER TYPE CONNECTOR
Document Type and Number:
Japanese Patent JP2004335218
Kind Code:
A
Abstract:

To effectively reduce a connector dimension in its laminating direction, and effectively reinforce a housing, while avoiding molding of thin-walled walls over a whole region of the housing.

The housing 10 is provided with a plurality of terminal containing rooms 14 lined up in a specific direction, and it constitutes a laminated connector by being mutually laminated in a direction crossing the line-up direction. At least a rear part of each terminal containing room 14 is opened up on one side of the laminated direction, and a terminal support wall 17 is formed on the other side. A reinforcing wall 16A is formed at one part of the open region, and a notch 16B of the part corresponding to the reinforcing wall is formed on the opposite side of the open region, and the reinforcing wall of the housing laminated on the bottom wall 17 side is made capable of being fitted into the notch 16B.


Inventors:
TAMAGAWA TATSUO
HIRAI HIROKI
Application Number:
JP2003127998A
Publication Date:
November 25, 2004
Filing Date:
May 06, 2003
Export Citation:
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Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01R13/514; H01R13/42; (IPC1-7): H01R13/514; H01R13/42
Domestic Patent References:
JPH0465078A1992-03-02
JPH02223171A1990-09-05
JPH1079270A1998-03-24
JP2003017177A2003-01-17
JPH065147U1994-01-21
Attorney, Agent or Firm:
Etsushi Kotani
Kyuichi Ueki
Muramatsu Toshiro