Title:
貼り合せ基板の分断方法
Document Type and Number:
Japanese Patent JP5156085
Kind Code:
B2
Inventors:
Ikuyoshi Takamatsu
Application Number:
JP2010276706A
Publication Date:
March 06, 2013
Filing Date:
December 13, 2010
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/07; B28D1/24; B28D5/00; C03B33/027
Domestic Patent References:
| JP2007233128A | ||||
| JP2010516481A | ||||
| JP2012027272A |
Foreign References:
| WO2009157440A1 |
Attorney, Agent or Firm:
Yoshio Kashima