Title:
接合部の形成方法
Document Type and Number:
Japanese Patent JP2006526892
Kind Code:
A
Abstract:
A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure.
Inventors:
Fuhatasaro, Lauri
Jarbinen, Yusso
Koivisto, terrorism
Stromberg, Samuri
Jarbinen, Yusso
Koivisto, terrorism
Stromberg, Samuri
Application Number:
JP2006508330A
Publication Date:
November 24, 2006
Filing Date:
June 01, 2004
Export Citation:
Assignee:
UPM RAFSEC OY
International Classes:
H05K3/32; G06K19/07; G06K19/077; H01L21/56; H01L21/60; H01L23/498; H01R4/04; H05K1/18
Domestic Patent References:
| JPH11312711A | 1999-11-09 | |||
| JPH11340280A | 1999-12-10 | |||
| JPH0730236A | 1995-01-31 | |||
| JP2002141373A | 2002-05-17 | |||
| JPH0590982U | 1993-12-10 | |||
| JP2001015555A | 2001-01-19 |
Attorney, Agent or Firm:
Takao Katori