Title:
レーザービームおよびマスクを使用した研磨パッドの作製方法
Document Type and Number:
Japanese Patent JP2004536716
Kind Code:
A
Abstract:
Disclosed is a method for forming micro-holes, perforated holes, and/or grooves on a polishing pad using a laser beam and a mask. This method involves the steps of determining a pattern of micro-holes, grooves, and/or perforated holes to be formed on a polishing pad, inputting the determined pattern to a computer numerical control (CNC) controller, selecting a mask corresponding to the determined pattern, positioning the mask under a laser device, parallel to the polishing pad, and driving the laser device adapted to irradiate the laser beam and a table adapted to conduct a three-dimensional movement and rotation while supporting the polishing pad, under the control of the CNC controlled, thereby irradiating the laser beam from the laser device through the mask onto the polishing pad according to the inputted pattern.
Inventors:
Park, Inn-Ha
Kuon, Tae Kyung
Kim, Jae-suk
Kuon, Tae Kyung
Kim, Jae-suk
Application Number:
JP2003516742A
Publication Date:
December 09, 2004
Filing Date:
August 02, 2002
Export Citation:
Assignee:
SK Company, Limited
International Classes:
B24B37/00; B23K26/00; B23K26/04; B23K26/06; B23K26/08; B23K26/36; B23K26/38; B24B37/26; B24D11/00; B24D13/14; H01L21/304; A61B17/56; (IPC1-7): B24B37/00; B23K26/00; B23K26/06; H01L21/304
Attorney, Agent or Firm:
Calyx
Toshio Nakamura
Miyazaki Yoshio
Tsutomu Kato
Toshio Nakamura
Miyazaki Yoshio
Tsutomu Kato