Document Type and Number:
Japanese Patent JP5516855
Kind Code:
B2
Abstract:
To provide a silver paste which does not cause disconnection or short circuit of an electric circuit, an electrode or the like.
The silver paste contains silver particulates having an average particle size of 0.8 μm or more and 1.0 μm or less and a tap density of 4 g/cm3or more which are deposited by using a main reducing agent and a sub-reducing agent which is stronger in reducing force than the main reducing agent, and adding the main reducing agent into the silver ion solution under existence of the sub-reducing agent based on the method of reduction-depositing silver particulates by adding a reducing agent in a silver ion solution, and viscosity of the silver paste is 170,000 cp or more and 190,000 cp or less. Particularly, the silver paste contains silver particulates which are deposited, for example, by adjusting the molar ratio (sub-silver-reducing agent ratio) of the sub-reducing agent against silver concentration to 1.0×10-5-2.0×10-6. An electric circuit or an internal electrode formed of the silver paste is provided and an electronic component including these is also provided.
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
Yoshimasa Hayashi
Ryuji Uesugi
Kaoru Nishizawa
Miyami Masami
Akihiro Higami
Takahiro Uno
Ichisuke Sato
Application Number:
JP2009242555A
Publication Date:
June 11, 2014
Filing Date:
October 21, 2009
Assignee:
Mitsubishi Materials Corporation
International Classes:
H01B13/00; B22F1/00; B22F9/24; H01B1/00; H01B1/22; H01F17/00; H01G4/232
Attorney, Agent or Firm:
Hiroshi Chiba
