To prevent generation of swelling of frequency characteristic and oscillation which are caused by the phenomenon where a part of a high-level signal permeates in the input side through space propagation due to the level difference between an inputted low level signal and an outputted high-level signal, when a multi-stage high-gain amplifier is realized in a package divided in several stages, in a high-frequency band.

The number of stages of a multi-stage amplifier circuit per dielectric substrate is reduced to the degree that oscillation is not generated, and a dielectric substrate is divided and arranged on the upper surface and the lower surface of the inside of a hybrid IC package.