Title:
ＩＣ化磁気センサおよびそれに使用するリードフレーム
Document Type and Number:
Japanese Patent JP7097671
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an integrated magnetic sensor that has a fast detection response speed, a high manufacturing yield, and high reliability, and a lead frame used therefor.SOLUTION: An IC chip mount part 20 of a lead frame 10 is formed with a base 21 and one or more horn-like parts 22, 23 projecting at a right angle from the base 21. A total length of the base 21 and horn-like parts 22, 23 is determined according to a length of a side corresponding to the IC chip 40, and a magnetoelectric conversion element arrangement part 44 of the IC chip 40 is arranged between the horn-like parts 22, 23.SELECTED DRAWING: Figure 1
Inventors:
Nobuyuki Shinchi
Application Number:
JP2017004757A
Publication Date:
July 08, 2022
Filing Date:
January 15, 2017
Export Citation:
Assignee:
Kojin Electric Co., Ltd.
International Classes:
G01R33/02; G01R33/07; H01L23/50; H01L43/04
Domestic Patent References:
| JP2011043331A | ||||
| JP2015137948A | ||||
| JP2015514207A |
Foreign References:
| US20150185279 | ||||
| US20130181304 |
Attorney, Agent or Firm:
Patent Business Corporation Sunnext International Patent Office
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