PURPOSE: To obtain a high speed flow, prevent stagnation of particles, and improve peeling power, by installing a peeling solution jetting part which makes peeling solution flow out through a multihole plate and spouts the releasing solution against a substrate in a peeling treatment part.

CONSTITUTION: When substrates W accomodated in a cassette C are dipped in a peeling tank 1, peeling solution is supplied to a peeling solution supplying part 9a and a peeling solution jetting part 7a. The peeling solution supplied to the peeling solution supplying part 9a passes holes of a multihole plate 6a from below to the upside, and flows toward the substrates W. The peeling solution supplied to the peeling solution jutting part 7a flows obliquely upward from a nozzle toward the part between substrates arranged in parallel. These flows join to form a high speed flow free from eddy. Thereby stagnation of particles can be prevented, and the flow velocity can be kept high, so that peeling power can be improved.