Title:
【発明の名称】蒸気援助回転乾燥方法および装置
Document Type and Number:
Japanese Patent JP2003511849
Kind Code:
A
Abstract:
A process for drying semiconductor wafers includes loading a wafer wetted with rinsing fluid into a rotor and orientating the wafer along a substantially vertical plane. A gas saturated with a solvent vapor is passed over the wafer surfaces until condensation forms on the wafer and displaces residual fluid. The rotation of the wafer by the rotor at a first rotation speed to aids the flushing and displacement of residual fluid. The passage of a dry gas over the wafer combined with the rotation of the wafer at a second rotation speed promotes drying of solvent condensed on the wafer. The first rotation speed is limited to a rate that does not cause the condensed solvent film to evaporate as quickly as it forms. The second rotation speed may exceed that of the first rotation speed to complete the drying of the wafer. The rotor and process chamber are optionally pre-saturated with condensed solvent vapor prior to the introduction of a wafer to hasten the drying process. The process is suitable for quickly and cleanly drying patterned wafers having both hydrophobic and hydrophilic surfaces.
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Inventors:
Eric Jay Bergman
Application Number:
JP2001528404A
Publication Date:
March 25, 2003
Filing Date:
September 28, 2000
Export Citation:
Assignee:
Semitour Incorporated
International Classes:
F26B5/08; F26B9/06; F26B11/04; F26B21/00; H01L21/00; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; F26B5/08; F26B9/06; F26B11/04; F26B21/00
Domestic Patent References:
| JPH0938595A | 1997-02-10 | |||
| JPH10256221A | 1998-09-25 | |||
| JPH1167713A | 1999-03-09 | |||
| JPH1197403A | 1999-04-09 |
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)