【発明の名称】サブアッセンブリを加熱する半導体処理炉

Title:

【発明の名称】サブアッセンブリを加熱する半導体処理炉

Document Type and Number:

Japanese Patent JP2001517363

Kind Code:

A

Inventors:

Weaver, Robert A.
Smith, john zett
Martin Earl, Jones
McHugh, Paul Earl

Application Number:

JP53855298A

Publication Date:

October 02, 2001

Filing Date:

February 20, 1998

Export Citation:

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Assignee:

Semitour Incorporated

International Classes:

F27D3/12; C30B31/12; F27B5/04; F27D15/02; F27D19/00; H01L21/00; H01L21/22; H01L21/324; H01L21/677; (IPC1-7): H01L21/22; F27B5/04; F27D3/12; F27D15/02; F27D19/00; H01L21/22; H01L21/324

Attorney, Agent or Firm:

Aoyama Ryo (1 person outside)

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