Title:
【発明の名称】金属化合物の研磨剤を用いて、超小形電子基板を機械的および化学機械的に平坦化する方法および装置
Document Type and Number:
Japanese Patent JP2003508903
Kind Code:
A
Abstract:
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a fixed abrasive polishing pad having metal abrasive elements selected to be a compound of metal in the substrate. Alternatively, the metal abrasive elements can include a refractory metal where the substrate includes a refractory metal. Where the substrate includes two metals, the abrasive elements can be selected to planarize the first metal at a rate that is less than approximately twice the rate at which it planarizes the second metal. A single fixed abrasive polishing pad and a single planarizing liquid can be used to planarize both metals.
Inventors:
Sabde, Gandu M.
Mayle, scott
Mayle, scott
Application Number:
JP2001520252A
Publication Date:
March 04, 2003
Filing Date:
August 30, 2000
Export Citation:
Assignee:
MICRON TECHNOLOGY,INC.
International Classes:
B24B1/00; B24B21/00; B24B37/04; B24D11/00; B24D13/14; C09K3/14; H01L21/304; H01L21/321; H01L21/768; (IPC1-7): H01L21/304; B24B1/00; B24B37/00; C09K3/14
Attorney, Agent or Firm:
Shusaku Yamamoto