Title:
【発明の名称】クリーニング組成物および残留物を除去する方法
Document Type and Number:
Japanese Patent JP2002515537
Kind Code:
A
Abstract:
Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound;(ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.
Inventors:
Vincent Gee Leon
Kenji Honda
Eugene F. Rothgery
Kenji Honda
Eugene F. Rothgery
Application Number:
JP2000549692A
Publication Date:
May 28, 2002
Filing Date:
May 18, 1999
Export Citation:
Assignee:
OLIN MICROELECTRONIC CHEMICALS,INC.
International Classes:
C11D7/60; C11D1/62; C11D3/02; C11D3/06; C11D3/20; C11D3/24; C11D3/26; C11D3/28; C11D3/30; C11D3/34; C11D3/60; C11D7/06; C11D7/10; C11D7/16; C11D7/26; C11D7/32; C11D7/34; C11D11/00; C11D17/08; G03F7/42; H01L21/302; H01L21/304; H01L21/3065; (IPC1-7): C11D1/62; C11D3/24; C11D3/30; C11D17/08
Attorney, Agent or Firm:
Chika Takagi (1 person outside)