To prevent sealing resin surrounding a semiconductor chip from coming off when a load of bending, point pressing, etc., are applied in an IC card provided with a reinforcing plate.
In the IC card 1 obtained by molding the surrounding of a semiconductor chip 6 mounted on a circuit sheet 2 with sealing resin 7 and laminating a reinforcing plate 10 on it, surface roughness Rmax on the opposite side of the circuit sheet 2 of a semiconductor chip 6 is set to be within a range from 0.005 μm to 0.5 μm. As the result of this, though shearing stress is generated at the resin 7 between the chip 6 and the plate 10 by a load of bending, point pressing, etc., applied to the IC card 1 at the time of actual using the resin 7 is prevented from coming off. Further, the chip itself is also prevented from being broken by the too roughness of the surface of the chip 6.
IIO JUNICHI
MATSUO YASUAKI
