Title:
IC TAG AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3836096
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an IC tag that is rendered flexible so that it can be stuck to a curved surface of an article and that is sealed in the form of a bag for water resistance, while having sufficient resistance to external forces although being thin.
SOLUTION: The IC tag is provided with a flexible electronic component retaining film having electronic components, i.e., an antenna coil that provides data communication without contact by means of an induced electromagnetic field, and an IC for recording authentication information. The electronic component retaining film serving as a center layer is covered on its top and bottom faces with flexible inner protective films each of which is thicker than the electronic components. The outside of each inner protective film is entirely covered with a flexible and thermoplastic outer protective film. The outer peripheral edge of the outer protective film is subjected to thermo compression bonding to seal the IC tag in the form of a bag.
Inventors:
Wakahiro Kawai
Shinoda Atsunori
Hiroaki Kawada
Shinoda Atsunori
Hiroaki Kawada
Application Number:
JP2003299499A
Publication Date:
October 18, 2006
Filing Date:
August 25, 2003
Export Citation:
Assignee:
OMRON Corporation
Mitsui Bussan Plastics Co., Ltd.
Mitsui Bussan Plastics Co., Ltd.
International Classes:
B42D15/10; G06K19/077; G06K19/07; (IPC1-7): G06K19/077; B42D15/10; G06K19/07
Domestic Patent References:
| JP2003016412A | ||||
| JP2000293648A | ||||
| JP8258470A | ||||
| JP2002352207A | ||||
| JP11034557A |
Attorney, Agent or Firm:
Yoshiaki Nagata
Motoaki Nagata
Motoaki Nagata
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