Title:
IC TEST SOCKET
Document Type and Number:
Japanese Patent JPH06194412
Kind Code:
A
Abstract:
PURPOSE: To provide an IC test socket which is suited to a burn-in test, etc., for a high density IC chip and applicable to a high-speed signal.
CONSTITUTION: An IC test socket 10 connects an IC chip 94 having a plurality of bonding pads to a circuit pad 22 of a substrate 20 mutually. The socket 10 is provided with a base part 12, a top part 16, and a plastic film 14 having a circuit trace 72 formed thereon. Contact pins 58 are held in a plurality of contact pin holding holes 58 of a contact pin holding part 50 in the top part 16 with their both ends projected. The contact pins 58 connect the bonding pads of the IC chip 94 across the circuit trace 72 of the film 16.
Inventors:
DEIMITORII JII GURATSUBE
IOSHIFU KOOSANSUKII
DANIERU ROBAATO RINGURAA
IOSHIFU KOOSANSUKII
DANIERU ROBAATO RINGURAA
Application Number:
JP31440492A
Publication Date:
July 15, 1994
Filing Date:
October 30, 1992
Export Citation:
Assignee:
WHITAKER CORP
International Classes:
H01L21/66; H01R33/76; H05K7/10; G01R31/26; (IPC1-7): G01R31/26; H01L21/66; H01R33/76
Attorney, Agent or Firm:
Japan MPM Co., Ltd.