To provide an image pick-up element capable of electronic scanning for easing signals of each pixel constituting the image pick-up element synchronously with the modulation of the thermal energy of each pixel.
Pixel sensors 15, 16, 18 are formed on a diaphragm 13 formed as a structure thermally isolated from a support board 10 through a gap 30 so that a voltage is applied/cut off between a lower electrode 15 provided on the diaphragm 13 and an electrode 25 provided on the support board 10, thereby mechanically contacting/separating the diaphragm and the board 10 to modulate the thermal energy of the sensor, and the electronic scan for reading signals of the image pick-up element is synchronized with the thermal energy modulation of each pixel. The thermal energy modulation of each pixel can be made by applying electric signals, without using a mechanical chopper mechanism, hence the thermal energy modulation of each pixel can be scanned at a desired timing by the electric signals and easily synchronized with the electronic scan for reading signals.
IWASAKI YASUKAZU
KLEISON TRONNAMCHAI
Next Patent: MICRODEVICE AND MANUFACTURE THEREOF