Title:
撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
Document Type and Number:
Japanese Patent JP5291892
Kind Code:
B2
Abstract:
In an image pickup element module, a heat releasing member disposed to be thermally coupled to an FPC substrate and an image pickup element is formed of a PPS resin material having good thermal conductivity. Further, this image pickup element module is configured so that a phase-changing heat storage which is insert-molded or formed into a sheet shape is disposed to be thermally coupled to the heat releasing member.
Inventors:
Kunio Yamamiya
Application Number:
JP2007121126A
Publication Date:
September 18, 2013
Filing Date:
May 01, 2007
Export Citation:
Assignee:
Olympus Imaging Corporation
International Classes:
H04N5/335; G02B7/02; G03B11/00; G03B17/02; H01L27/14; H04N5/225; H04N5/372; H04N5/374
Domestic Patent References:
| JP2007049369A | ||||
| JP2006174226A | ||||
| JP2008524832A | ||||
| JP2004111665A | ||||
| JP2002009211A | ||||
| JP2005175854A | ||||
| JP1103071A | ||||
| JP1123214A | ||||
| JP2008271487A |
Foreign References:
| WO2006047240A1 |
Attorney, Agent or Firm:
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto