Title:
撮像装置および撮像装置の製造方法
Document Type and Number:
Japanese Patent JP7184772
Kind Code:
B2
Abstract:
A bonding pad formed to a desired thickness is arranged close to a surface of an image sensor. An imaging apparatus includes a semiconductor substrate, a wiring layer, and a signal transmission section. On the semiconductor substrate, a photoelectric conversion section for generating an image signal corresponding to emitted light is formed. The wiring section is formed by having an insulation layer and a wiring layer stacked one on top of the other. The signal transmission section is formed between a recessed section formed on a surface different from the light-receiving surface of the semiconductor substrate on the one hand and the wiring section on the other hand, the signal transmission section being arranged partially in the recessed section. The signal transmission section transmits an image signal transmitted by the wiring layer through an opening formed from the light-receiving surface of the semiconductor substrate toward the recessed section.
Inventors:
Keiji Inoue
Eiichiro Kanda
Eiichiro Kanda
Application Number:
JP2019530941A
Publication Date:
December 06, 2022
Filing Date:
June 22, 2018
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
H01L27/146; H01L21/3205; H01L21/60; H01L21/768; H01L23/522; H04N5/369; H04N5/374
Domestic Patent References:
| JP2005191492A | ||||
| JP2016129216A | ||||
| JP2012019147A | ||||
| JP2014099582A |
Attorney, Agent or Firm:
Kenichiro Matsuo
Yasuo Ichikawa
Yasuo Ichikawa
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