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Title:
INDIUM TARGET AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2013227632
Kind Code:
A
Abstract:

To provide an indium target the film deposition rate of which can be improved, and to provide a method for manufacturing the same.

A method for manufacturing an indium target includes a step of producing a rolled body of a cast ingot of an indium metal, and a step of performing the heat treatment of the rolled body in the atmosphere. The indium target which is thus manufactured has a sputtering surface whose surface roughness (Ra) after the elapse of the target life 15 hWh is ≤25 μm when the sputtering is performed under the condition of a pressure of 0.1-3 Pa, and a power density of 0.1-6 W/cm2.


Inventors:
MASUDA TADASHI
MURAKI MIKI
NAKADAI YASUO
AKAMATSU YASUHIKO
MATSUMOTO TAKESHI
OTOMO MASAHIKO
NAGASAWA SHOJI
OGINOSAWA TAKATOSHI
Application Number:
JP2012101682A
Publication Date:
November 07, 2013
Filing Date:
April 26, 2012
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/34
Domestic Patent References:
JP2012052194A2012-03-15
JP2008127623A2008-06-05
JP2001049426A2001-02-20
JP2004052111A2004-02-19
JP2011127160A2011-06-30
JP2011236445A2011-11-24
Foreign References:
US20050279630A12005-12-22
US20030052000A12003-03-20
Attorney, Agent or Firm:
Junichi Omori
Ori Akira