INDIVIDUALLY PROCESSED ADHESIVE FILM, METHOD FOR MANUFACTURING CONNECTED STRUCTURE, AND CONNECTED STRUCTURE

Title:

INDIVIDUALLY PROCESSED ADHESIVE FILM, METHOD FOR MANUFACTURING CONNECTED STRUCTURE, AND CONNECTED STRUCTURE

Document Type and Number:

Japanese Patent JP2023151680

Kind Code:

A

Abstract:

To provide an individually processed adhesive film, a method for manufacturing a connected structure, and the connected structure that can improve adhesive strength to a substrate on which components are mounted.SOLUTION: An individually processed adhesive film is made up of a substrate on which components are mounted, and individual pieces each having an opening that surrounds the component are arranged in the longitudinal direction of a base film. In addition, in a method for manufacturing the connected structure, a terminal of a first electronic component and a terminal of a second electronic component are connected to the substrate on which the components are mounted using a piece having an opening surrounding the component. Therefore, the adhesive strength can be improved.SELECTED DRAWING: Figure 1

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Inventors:

TANAKA YUSUKE
TAMAGAWA SHOGO

Application Number:

JP2022061428A

Publication Date:

October 16, 2023

Filing Date:

March 31, 2022

Export Citation:

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Assignee:

DEXERIALS CORP

International Classes:

H05K3/32; C09J7/00; H01R11/01

Attorney, Agent or Firm:

Nobuhiro Noguchi
Satoshi Hotani

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