Title:
INFRARED SOLID-STATE IMAGE PICK-UP DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3529596
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an infrared solid-state image pick-up device in which a thermal conductance across the hot junction of a thermocouple and a semiconductor substrate can be made sufficiently small and whose infrared detecting sensitivity is enhanced.
SOLUTION: In an infrared solid-state image pick-up device, a thermoelectric conversion part in which a temperature change generated by the irradiation of an infrared absorber layer with infrared rays is converted into an electric signal and a signal output part which outputs a signal generated by the thermoelectric conversion part are provided on a semiconductor substrate 1. The thermoelectric conversion part is constituted of a thermocouple. A hot-junction metal 7-1 for the thermocouple, a first diaphragm 10 which supports the infrared absorber layer and a second diaphragm 9 which supports wiring parts 3, 4 for the thermocouple are formed. The first and second diaphragms 10, 9 comprise support parts 10a, 9a independently between themselves and the semiconductor substrate 1. The infrared absorber layer and the hot- junction metal 7-1 for the thermocouple are arranged on a hollow structure 8 on the semiconductor substrate 1 by the first diaphragm 10, and the wiring parts 3, 4 are arranged on the hollow structure 8 by the second diaphragm 9.
Inventors:
Iida, Yoshinori
Application Number:
JP21197897A
Publication Date:
May 24, 2004
Filing Date:
August 06, 1997
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01J1/02; B81B3/00; G01J5/02; G01J5/12; G01J5/20; H01L31/09; H01L31/102; H01L35/32; (IPC1-7): G01J1/02; G01J5/02; H01L35/32
Attorney, Agent or Firm:
鈴江 武彦 （外６名）