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Patent Searching and Data


Title:
INJECTION MOLD ASSEMBLY
Document Type and Number:
Japanese Patent JPS63281813
Kind Code:
A
Abstract:

PURPOSE: To prevent sinking from developing without being effected by the height of a boss and at the same time under the state that the height of the boss is stabilized by a structure wherein a slit, which is provided along the outer periphery at the root of the boss and through which the pressure of gas or liquid is applied, and a fluid circuit, by which said slit is connected to the outside of a mold, are provided.

CONSTITUTION: Molten resin is filled through a sprue 5 in a product part 7 and a boss part 8. If cooling proceeds as is, sinking develops on the surface 23 of the boss 8 due to the shrinkage of the resin. However, when high gas or liquid pressure is applied to a core fluid circuit 22 from the outside of a mold after the filling of the resin, said pressure is transmitted through a fluid circuit 21 and a slit 20 to the root of a boss 8 so as to press the resin at the root. Thus, said resin is pressed to a cavity side, resulting in preventing sinking from developing. In addition, since the slit 20 is fine, no resin enters the slit and consequently no clogging of the slit occurs.


Inventors:
MORIMOTO TAKASHI
HARA YOSHIHIRO
KANDA TSUMORU
TAMAI SHOJI
Application Number:
JP11731387A
Publication Date:
November 18, 1988
Filing Date:
May 14, 1987
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B29C45/26; B29C45/17; B29C45/76; (IPC1-7): B29C45/26; B29C45/76
Attorney, Agent or Firm:
Toshio Nakao