Title:
INJECTION MOLD AND INJECTION MOLDING MACHINE
Document Type and Number:
Japanese Patent JP3490404
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the generation of molding defectiveness by suppressing the lowering in the flowability of a resin while preventing the deformation of a case such as a battery lid or the like arranged in a mold.
SOLUTION: The injection mold 1 has a case 2 arranged in the cavity formed therein and is used in order to fill the gap between the case 2 and the loaded part 3 arranged inside the case 2 with a molten resin. This injection mold 1 is equipped with the groove 13 opened to the cavity at the position covered with the case 2 and both of the cooling medium supply port 15 and the cooling medium discharge port 16 communicating with the groove 13.
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Inventors:
Hiroyuki Hirota
Yasuhiko Ogawa
Yasuhiko Ogawa
Application Number:
JP2001074535A
Publication Date:
January 26, 2004
Filing Date:
March 15, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B22D17/00; B28B1/24; B29C45/00; B29C45/14; B29C45/20; B29C45/37; B29C45/26; B29C45/72; B29C48/305; H01M10/04; (IPC1-7): B29C45/26; B29C45/14; B29C45/20; B29C45/37; B29C45/72
Domestic Patent References:
| JP938979A | ||||
| JP5124066A | ||||
| JP2002195712A | ||||
| JP452022U |
Attorney, Agent or Firm:
Masatake Shiga (3 outside)