Title:
INSPECTION METHOD AND INSPECTION DEVICE
Document Type and Number:
Japanese Patent JP3945638
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an inspection method capable of effectively inspecting a plurality of measurement and characteristics to be inspected, and to provide an inspection device.
SOLUTION: The bump inspection device is provided with a 1st and a 2nd frame memories (image buffer 1, 2) for storing images taken by a CCD. An image inputting circuit inputs taken image data to the 1st frame memory or the 2nd frame memory alternately. While one memory is taking the image data, another memory is subjected to processing taken image data for measurement and inspection.
Inventors:
Takanori Ito
Application Number:
JP2002118234A
Publication Date:
July 18, 2007
Filing Date:
April 19, 2002
Export Citation:
Assignee:
富士通株式会社
株式会社アルバック
株式会社アルバック
International Classes:
G01B11/02; G01B11/00; G01B11/30; G01N21/956; H01L21/60; (IPC1-7): G01B11/02; G01B11/00; G01B11/30; G01N21/956; H01L21/60
Domestic Patent References:
| JP4104045A | ||||
| JP200074845A | ||||
| JP2000161916A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda
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