Title:
INSTALLATION HEAD FOR ELECTRONIC PARTS MOUNTED DEVICE
Document Type and Number:
Japanese Patent JP2002137185
Kind Code:
A
Abstract:
To provide an installation head capable of improving the cooling effect for cooling a driving means for a suction nozzle and improving the electronic parts mounting accuracy and to be miniaturized without requiring a special cooling driving means.
This installation head is provided with a driving means for driving a suction nozzle for sucking parts and installing it in a substrate. Discharged air of a vacuum generation device to the suction nozzle is discharged toward the driving means to cool the driving means. The driving means can be thereby cooled and the electric part installation degree can be improved. Since a special cooling driving means is unnecessary, miniaturization of the whole of the suction head is realized.
Inventors:
HIRAMATSU TORU
KAZAHARU HIROYUKI
IIJIMA KUNIHIKO
KAZAHARU HIROYUKI
IIJIMA KUNIHIKO
Application Number:
JP2000328536A
Publication Date:
May 14, 2002
Filing Date:
October 27, 2000
Export Citation:
Assignee:
JUKI KK
TAMAGAWA SEIKI CO LTD
TAMAGAWA SEIKI CO LTD
International Classes:
B25J15/06; H05K7/20; H05K13/04; (IPC1-7): B25J15/06; H05K7/20; H05K13/04
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