Title:
INSTALLATION PATHWAY FORMING DEVICE OF WIRING/PIPING MATERIAL AND LAYING METHOD OF WIRING/PIPING MATERIAL
Document Type and Number:
Japanese Patent JP2023017274
Kind Code:
A
Abstract:
To provide an installation pathway forming device of a wiring/piping material which can perform operation while visually confirming positions of the wiring/piping material stored inside a corrugated tube and a split portion of the corrugated tube and has high deformation resistant stiffness with respect to drop collision of a falling object and the like.SOLUTION: An installation pathway forming device comprises: a plurality of corrugated tubes D which have hollow cylindrical forms having rectangular cross sections having installation pathways of a wiring/piping material P inside, wherein recessed and projection parts alternately arranged in a longer direction are formed on the inside and outside faces; and a coupler C connecting the two continuous corrugated tubes D on an opposite end. The coupler C includes: a pair of separation regulating locking projection parts 23 which are inserted into respective inner surface recessed parts 3 of the two connected corrugated tubes D and regulates separation; and a relative rotation regulating projection part 26 which does not allow relative rotation only with respect to one corrugated tube D. The coupler C is constructed to allow relative rotation with respect to the other corrugated tube D.SELECTED DRAWING: Figure 17
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Inventors:
KITAMURA YUSUKE
Application Number:
JP2021121406A
Publication Date:
February 07, 2023
Filing Date:
July 26, 2021
Export Citation:
Assignee:
MIRAI IND
International Classes:
H02G3/06; F16L57/00; H02G3/04; H02G9/06
Attorney, Agent or Firm:
Tetsuhiro Naito
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