絶縁材料、配線基板及び半導体装置

Title:

絶縁材料、配線基板及び半導体装置

Document Type and Number:

Japanese Patent JP5234729

Kind Code:

B2

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Inventors:

Yukihiro Kiuchi
Ryutaro Tanaka

Application Number:

JP2007283427A

Publication Date:

July 10, 2013

Filing Date:

October 31, 2007

Export Citation:

Assignee:

NEC
NIPPON KAYAKU KABUSHIKI KAISHA

International Classes:

C08G59/44; H01L23/14; H05K1/03

Domestic Patent References:

Foreign References:

WO2008072630A1
WO2007052523A1

Attorney, Agent or Firm:

Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata

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