To obtain a build-up insulating resin composition for multi-layer printed-wiring boards having excellent storage stability, reduced temperature dependence of volume resistivity after curing and most suitable for via holes by laser.
The insulating resin composition for multi-layer printed-wiring boards comprises a monomer having at least one ionically polymerizable functional group, a polymeric compound having at least one ionically polymerizable functional group, and a heat activation ionic polymerization catalyst which has a ≥10C substituted or nonsubstituted hydrocarbon group or at least one cyclic organic structure having a ≥10C substituted or nonsubstituted hydrocarbon group in the molecule and can effect dissolution and deposition by heating and cooling, respectively.
MARUO KATSUYA
TAKAI HIDEYUKI
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